M-BOND™ 610 Adhesive

M-BOND™ 610 Adhesiveion milling, cross sectioning This is a nonconductive, two component, solvent thinned, epoxy phenolic adhesive for high performance applications. Chemically resistant and provides a thin layer of glue which has good ion milling properties. It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems. Solids content is 22%. It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to

Key features

Material  Part number Copper 7XC200B Pattern Pitch microns Mesh Hole microns Bar microns Transmission % Tolerance +/-microns  7X_200B 127 200 100 27 68 3

airtight construction ideal for pathology laboratories

Width x Thickness 5044-SV

Trough is ¼"Wx1/8"Dx1-1/2"L (6

It is less suitable for mounting small or powder like specimen due to the fibers in the adhesive and the topographic surface

(3) 22G Dispense Needles (#83075-22)

GSR Kit is designed to avoid any contamination of the GSR samples

True North® Freezer Boxes - polypropylene film

and all PELCO® Pro Cyanoacrylate Adhesives

Mesh (lines/inch) 150 Pitch (um) 165 Bar Width (um) ~25 Hole Width (um) ~140 Rim Specifications Rim width (mm) N/A Centre Mark None Rim Mark Yes Availability Gold per Vial 50 Other per Vial 100 2

ID mat for each design